2018年SPIE第25届国际智能结构和材料系统非破坏性评估国际研讨会

[基本信息]

会议名称:2018年SPIE第25届国际智能结构和材料系统非破坏性评估国际研讨会

SPIE 25th Annual International Symposium on Smart Structures and Material Systems + Nondestructive Evaluation

所属学科:材料科学基础学科,纳米科学与技术,高分子材料,复合材料

开始日期:2018-03-04

结束日期:2018-03-08

所在国家:美国

所在城市:美国

具体地点:美国 Denver, Colorado, United States

主办单位:国际光学工程学会

[重要日期]

摘要截稿日期:2017-08-21

[会务组联系方式]

会议网站:http://spie.org/conferences-and-exhibitions/smart-structures/nde

[会议背景介绍]

The Organizing Committee of SPIE's 25th Annual International Symposium on Smart Structures and Material Systems + Nondestructive Evaluation invites you to attend this year's meeting. This unique symposium offers many opportunities to network with colleagues from a variety of disciplines in academia, industry, and government from all over the world. Organized in ten parallel conferences, SS/NDE brings together emerging technologies and advanced research in instrumentation, sensing, and measurement science with advanced materials, diagnostics, and smart systems. Engineers and researchers from government, military, academia and the commercial sector will discuss the current status and future directions of smart structures and materials, NDE, and health monitoring. Case studies, emerging research agendas, and innovative new technologies will be presented. The Symposium covers all aspects of the evolving fields of materials, enabling technologies, sensor/actuator design, and applications of these technologies to cover the whole spectrum of life in the 21st century, including commercial, medical, aerospace, and military fields. It also includes several conferences on NDE and structural health monitoring, safety, security, characterization of materials, detection of materials defects and degradation, evaluation of the state of damage enabling reliable component failure prediction, application of micro- and nanomaterial systems, energy systems and infrastructure. New conference topics related to the Internet of Things, Industry 4.0, and use of data in product design, fabrication, maintenance, and system management will also be explored for the first time.